Close this search box.
Close this search box.
Close this search box.

 Advancement in Packaging of semiconductor manufacturing

Follow Us:

Key Highlights

  • Packaging influences the power, efficiency, and expense of semiconductors.
  • Through-hole technology is one of the common types of semiconductor packaging.
  • Samsung is advancing the packaging technology by launching I-Cube4.

How packaging affects the production?

A semiconductor box packaging is made of metal, plastic, glass, or ceramic that houses one or more isolated semiconductor devices or integrated circuits. Packaging is a critical component of semiconductor production and design. On a macro level, it influences power, efficiency, and expense, and on a micro-level, it influences the basic functionality of all chips. 

Common types Of packaging used in semiconductor

  • Through-hole technology- It refers to an electronic device mounting scheme that requires the use of leads on the components that are threaded into holes drilled in printed circuit boards (PCB) and soldered to pads on the opposite side either by hand positioning or by the use of automatic injection mount machines.
  • Surface-mounted technologySurface-mount technology (SMT) is a way of directly mounting electrical components onto the surface of a printed circuit board (PCB). A surface-mount unit is an electrical component that is installed in this manner (SMD). SMT allows for improved manufacturing automation, which lowers costs and increases efficiency. 
  • Pin grid array- A PGA is a form of integrated circuit packaging. A PGA’s packaging is square or rectangle, and the pins are set in a standard array on the package’s underside. Pins are usually 2.54 mm (0.1″) apart and may or may not occupy the entire underside of the box. PGAs are sometimes threaded into sockets or placed on printed circuit boards using the through-hole technique. PGAs have more pins per integrated circuit than older packages like the dual in-line model (DIP).

Advancement In the technology

Samsung Electronics announced that it has evolved innovative chip packaging technologies for high-performance applications. South Korean technology behemoth looks to extend its leadership in semiconductor solutions. The world’s largest memory chip manufacturer said that its next-generation 2.5D packaging technology, Interposer-Cube4.(I-Cube4), is planned to be commonly used in fields such as high-performance computing, artificial intelligence (AI), 5G, cloud, and largest data center applicants because it improves connectivity and power quality between logic and memory chips. Wafer-level packaging (WLP) is a form of advanced packaging technology in which an integrated circuit is packed while still on the wafer. This packaging method will result in a wafer box that is approximately the same size as the original die.

Also Read: Compound Semiconductor Centre and Kubos formed partnership develop LED technologies



The Educational landscape is changing dynamically. The new generation of students thus faces the daunting task to choose an institution that would guide them towards a lucrative career.

Subscribe To Our Newsletter

And never miss any updates, because every opportunity matters.
Scroll to Top

Thank You for Choosing this Plan

Fill this form and our team will contact you.